Showing results: 241 - 255 of 343 items found.
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Lt665R -
Teledyne Lumenera
The Lt665R builds on EXview HAD II CCD Quad Tap sensor technology to deliver high quality imaging and high sensitivity in a compact camera rich in features. Low noise electronics ensure clear and sharp images rendering details with amazing accuracy. Its superior responsiveness positions it as a good choice for Near-Infrared (NIR) imaging. This camera is ideal for applications where high speed, sensitivity and resolution are critical including traffic, tolling, ophthalmology, life sciences, metrology, high-speed inspection, machine vision and NIR applications. A scientific-grade variant is available for the most demanding life science applications. The Lt665R can also be customized to suit OEM designs.
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A2T -
U. S. Digital
The A2T is a single axis, digital gravity angle sensor. The A2T serves as a full 360 range absolute tilt sensing programmable level with either digital or analog output. Internally, a rotary bar coded disk is mounted to a weighted gravity driven wheel. A micro-controller strobes an LED to transfer the bar code image onto an optical linear array, then decodes the position every 2 mSec. Magnetic damping provides fast response and settling time while virtually eliminating overshoot and oscillations. An internal EEPROM stores field programmable parameters such as resolution, zero position, direction swap, and mode. This second generation design virtually eliminates the primary accuracy limitation of first generation inclinometers, which is sitation (hysteresis).
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Lepton -
Pure Engineering, llc
The FLIR Lepton™ is the most compact longwave infrared (LWIR) sensor available as an OEM product. It packs a resolution of 80 × 60 or 160x120 pixels into a camera body that is smaller than a dime. This revolutionary camera core is poised to equip a new generation of mobile and handheld devices, as well as small fixed-mount camera systems, with thermal imaging capabilities never seen before. Lepton contains a breakthrough lens fabricated in wafer form, along with a microbolometer focal plane array (FPA) and advanced thermal image processing. In order to support the lepton and make it easy to use, we have developed a breakout board to support the module along with example source code. Please see the Lepton Thermal Camera Breakout Datasheet for more information.
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1D-glass Thickness Profile Measuring Instrument GPM2 -
Optik Elektronik Gerätetechnik GmbH
Highly accurate automatic measurement of glass thickness distributions. The glass thickness profiler GPM has the function to execute a fast and precise determination of the thickness profile of flat glass samples or another transparent material with a thickness range from 30µm to 700µm (option with sensor type 1) and width to 1200mm. The measuring point distance of the profile measurement can be varied over a micro-step-controlled positioning steering between 0.1mm and 1mm. The measured value accommodation for a scanning point takes place with the help of a special hardware module for image processing algorithms within 40 ms. The entire measuring time for a sample results thus as product from the sample width which has to be measured, the measuring point distance and the measuring time per measuring point.
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xiX -
XIMEA GmbH
*Smallest camera featuring Sony Pregius™ - Compact with only 26.4 x 26.4 x 31 mm and 30 grams (1)*Fast CMOS - High speed, high frame rate: from 2.3 Mpix at 166 Fps to 50 Mpix at 33 Fps*Cool economy - Low power consumption with under 3 Watt and minimal heat dissipation*All-around support - support for Windows 7 and 10, macOS, Linux, ARM and embedded platforms*Industry standard - Data and control interface complies with PCI Express External Cabling Specifications*Adaptable potential - Available with two flat ribbon flex cable connectors: parallel and perpendicular *Software interfaces - GenICam / GenTL and highly optimized API / SDK for Image Processing*Connectivity and Synchronization - Programmable opto-isolated input and output, 4 status LEDs*Lens control - EF-mount Interface allows remote control of aperture, focus and image stabilization*Highly Customizable - Variety of sensor options including Sony IMX287, IMX273, IMX249, IMX265, IMX264, IMX267, IMX304 available in board level stack for OEM use and with switches and adapters*Interoperability increase - Continuous embrace of new software and hardware partners*Cost efficient - Excellent value through utilization of the newest technologies including Sony Pregius™
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XM Bond HR -
Viscom AG
Viscom AG offers the new XM Bond HR camera module for dependable inspection of wire bonds. Its characteristics include a 21 mm x 21 mm field of view size and exceptionally fine detail resolution. It is ideally suited for the most precise inspection of thin wires in the production line. With the new XM Bond HR camera module, Viscom advances the configuration possibilities in wire bond inspection for higher in-line inspection quality. This module is particularly recommended for safety-relevant electronics, where thin wires with diameters of e.g. only 20 µm are installed. Products of this kind find use, among others, in various types of signal processing in the automotive and aerospace sectors. The high-quality optical components and sensor chips with first-class resolution and sensitivity achieve superb image quality and sharp detail resolution. Together with its 21 mm x 21 mm field of view size, the XM Bond HR offers a resolution of 4.5 µm per pixel. A telecentric lens ensures that regardless of the distance to an object, an inspection window has the same image scale; for example, the end points of an inspected thin wire are always located at the same positions in the inspection window. In addition, the telecentric optics also prevent areas on the electronic assembly next to tall components from being hidden.
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Thorlabs, Inc.
Thorlabs' Scientific-Grade Cameras are specifically designed for microscopy and other demanding applications. The Zelux™ CMOS cameras have small footprints and provide cost-effective solutions for general-purpose imaging applications. Kiralux® cameras have CMOS sensors with high quantum efficiency in a compact housing and are offered in monochrome, color, NIR-enhanced, and polarization-sensitive versions. Our polarization-sensitive CMOS camera is ideal for materials inspection, flaw detection, and other advanced techniques using polarization. The Quantalux® monochrome sCMOS cameras are fast frame rate imagers that combine high dynamic range with extremely low read noise for low-light applications. They are available in either a passively cooled compact housing or a hermetically sealed TE-cooled housing. We also offer scientific CCD cameras with a variety of features, including versions optimized for operation at UV, visible, or NIR wavelengths; fast-frame-rate cameras; TE-cooled or non-cooled housings; and versions with the sensor face plate removed. An intuitive software package, API and SDK for developers, and third-party software support provide options for custom system control and image acquisition.
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Sentera, llc
Sentera drone sensors deliver unrivaled performance and consistently beat competitors in price, quality and function. Our sensors produce high-quality, context-rich color and near-infrared (NIR) image data to deliver unsurpassed NDVI data to growers. Our state-of-the-art design and deep base of field experience enable us to produce sensors that deliver meaningful and actionable insights to our customers.
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ExciPro -
CDP Systems Corp.
ExciPro is the first on the market femtosecond transient absorption pump-probe spectrometer. Two linear image sensors are placed in the focal in the focal plane of an imaging spectrograph to measure probe and reference spectra originating from femtosecond white light continuum generator.
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Framos Technologies d.o.o.
Sony’s SLVS-EC interface standard has emerged as the best high speed interface to Sony’s best image sensors, enabling higher throughput, greater signal integrity, and simpler designs. Engineers developing solutions using Xilinx FPGAs and SoCs can take advantage of FRAMOS’s SLVS-EC RX IP Core, Evaluation Board and tested source code examples. Device builders and camera vendors can de-risk the design while reaping the benefits of Sony’s latest high-speed interface.
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ace L Series -
Basler Vision Components AG
Twelve ace L models offer resolutions of 9 and 12 megapixels and frame rates of up to 40 fps. Featuring the high-performance IMX253, IMX255, IMX267 and IMX304 sensors, they stand out for the famously brilliant Pregius image quality with a dynamic range of more than 70 dB and a high quantum efficiency over a broad spectrum of visible light into the NIR. Available with the proven GigE or USB 3.0 interface, and conform to GigE Vision 2.0 or the USB3 Vision standard.
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IDS Imaging Development Systems GmbH
The functions of classic vision sensors - such as barcode readers - are usually strictly defined and hardly expandable. IDS NXT shows that there is a different way: the freely programmable platform is not tied to any predefined tasks. Instead, users can develop and install vision apps themselves and then change and set up various image processing tasks in a short time. App development does not require any additional specialist knowledge, because it hardly differs from the development of a "classic" industrial camera application. The possibility of installing different types of vision apps creates universal application possibilities in numerous application areas, for example in optical quality assurance, as an analytical device in medical technology, for surveillance tasks using face recognition or vehicle and person counting.
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NEON-1000-MDX Series -
ADLINK Technology Inc.
ADLINK's NEON-1000 Series of industrial smart cameras supports the Intel® Movidius™ Myriad™ X VPU and a range of image sensors, providing users the flexibility to handle a wide variety of applications.
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iStar -
Andor Technology Ltd
The iStar family features a range of high resolution sensors for the sharpest images and spectral signatures acquisition, while maintaining the highest dynamic range. It uses a fiber-coupling arrangement to the image intensifiers for maximum collection efficiency, unlike lens-coupled configurations that would suffer from lower throughput, image vignetting and distortion.
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ICE40 LP/HX -
Lattice Semiconductor
*Available in three series with LUTs ranging from 384 to 7680: Low power (LP) and high performance (HX)*Integrated hard I2C and SPI cores that enable flexible device configuration through SPI*Match your preferred display to your application processor with interfaces such as RGB, 7:1 LVDS and MIPI DPI/DBI*Multi-source your image sensors by implementing flexible bridges supporting common interfaces such as HiSPi, subLVDS, LVDS and Parallel LVCMOS*Up to 128 kbits sysMEM™ Embedded Block RAM*Industry’s broadest range of 0.35 mm - 0.40 mm pitch BGAs fit in space-constrained applications
